| specification unit |
| Grindable wafer diameter - Φ8 inch |
| When using universal chuck: Φ4, 5, 6, 8 inch |
| Grinding method - Infeed method by workpiece rotation |
| Wheels used - Φ200mm Diamond Wheel |
| Spindle Rated power kW 4.2 |
| Rotation speed range min‐1 1,000 to 7,000 |
| Device dimensions (W × D × H) mm 1,200 × 2,670 × 1,800 |
| Equipment Mass kg Approx. 3,100 |
